PART |
Description |
Maker |
PCS124-330M-RC PCS124-331M-RC PCS124-100M-RC PCS12 |
Power Chip Shielded Inducto r s 1 ELEMENT, 120 uH, GENERAL PURPOSE INDUCTOR, SMD
|
Allied Components Inter... Allied Components International
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1206J6300180KCT 1206J6300180KCR 1206J6300101KCR 12 |
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000018 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000015 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000022 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00015 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00012 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000012 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00018 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000012 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000018 uF, SURFACE MOUNT, 1206 CHIP
|
Syfer Technology, Ltd.
|
SR0603BX222P2NGD SR0603BX102P3NGD SR0402BX821P1NGD |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0022 uF, SURFACE MOUNT, 0603 CHIP CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.001 uF, SURFACE MOUNT, 0603 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.00082 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0047 uF, SURFACE MOUNT, 0603 CHIP CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.00033 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.00056 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0012 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0033 uF, SURFACE MOUNT, 0603 CHIP
|
Presidio Components, Inc.
|
ECJ2FB0J225M ECJ2FB0J226M ECJ2FB0J475K ECJ2FB0J106 |
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 2.2 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 22 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 4.7 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 10 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT Multilayer Ceramic Capacitors(High Capacitance) Small size and high capacitance Multilayer Ceramic Capacitors High Capacitance Multilayer Ceramic Capacitors (High Capacitance) Multilayer Ceramic Capacitors High Capacitance
|
Panasonic, Corp. Panasonic Battery Group Panasonic Semiconductor
|
LDB211G9020C-001 LDB21906M20C-001 LDB21906M05C-001 |
Chip Multilayer Hybrid Baluns 1800 MHz - 2000 MHz RF TRANSFORMER Chip Multilayer Hybrid Baluns 887 MHz - 925 MHz RF TRANSFORMER Chip Multilayer Hybrid Baluns 800 MHz - 1000 MHz RF TRANSFORMER Chip Multilayer Hybrid Baluns 1500 MHz - 1700 MHz RF TRANSFORMER Chip Multilayer Hybrid Baluns 1600 MHz - 1800 MHz RF TRANSFORMER
|
Murata Manufacturing Co., Ltd.
|
HKQ0603W11NJ-T |
High-Q Multilayer Chip Inductors for High Frequency Applications (HK series Q type)
|
Taiyo Yuden (U.S.A.), I...
|
HKQ0603S1N4S-T-19 |
High-Q Multilayer Chip Inductors for High Frequency Applications (HK series Q type)[HKQ-S]
|
Taiyo Yuden (U.S.A.), I...
|
HKQ0603S1N1S-T HKQ0603S1N1S-T-19 |
High-Q Multilayer Chip Inductors for High Frequency Applications (HK series Q type)[HKQ-S]
|
Taiyo Yuden (U.S.A.), I...
|
HKQ0603W1N5C-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
HKQ0603W1N1S-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
HKQ04021N1S-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
HKQ04024N7J-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
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